Solder Paste Product
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Description
PT. Solder Indonesia develops Solder paste for SMT application. For manufacturing and repair. Avaialable in leadfree alloy and leaded alloy.
Flux usage benefits:
1. Slump resistant
2. Wide range of reflow profile types
3. Able to transport under normal temperature
4. Extensive tack time up to 72 hours
5. Clear post process residue
Flux usage benefits:
1. Slump resistant
2. Wide range of reflow profile types
3. Able to transport under normal temperature
4. Extensive tack time up to 72 hours
5. Clear post process residue
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Solder Paste Product
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